ETA Smartphone Inline SMT PCBA Router Machine ETA-IR180 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCB cutting machine,PCB cutter,PCB
The world-class precision and quality Spectrum® II system for assembly of mobile electronics, semiconductors, MEMS, and PCBs High Speed, High Accuracy, Precision Dispensing System. Higher consistency leads to higher yield and maximum profitability
Electronics Forum | Thu Oct 04 00:05:25 EDT 2018 | gaintstar
Flason SMT chip mounter Reflow Ovens: http://www.flason-smt.com/product/PCB-assembly-line-equipment-SMT-spare-parts-Dek-Motor-188962.html http://www.flason-smt.com/product/PCB-Conveyor-for-LED-Production-Line-SMT-Assembly-Line.html http://www.flason-
Industry News | 2015-01-21 21:05:20.0
MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #2333 at the 2015 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 24–26, 2015 at the San Diego Convention Center.
Industry News | 2023-07-20 14:31:18.0
SMT and DIP technologies play a key role in the manufacturing of communication equipment.
Technical Library | 2016-01-12 11:01:25.0
More and more Land Grid Array (LGA) components are being used in electronic devices such as smartphones, tablets and computers. In order to enhance LGA mechanical strength and reliability, capillary flow underfill is used to improve reliability. However, due to the small gap, it is difficult for capillary underfill to flow into the LGA at SMT level. Due to cost considerations, there are usually no pre-heating underfill or cleaning flux residue processes at the SMT assembly line. YINCAE solder joint encapsulant SMT256 has been successfully used with solder paste for LGA assembly. Solder joint encapsulant is used in in-line LGA soldering process with enhanced reliability. It eliminates the underfilling process and provides excellent reworkability. The shear st rength of solder joint is stronger than that of underfilled components. The thermal cycling performance using solder joint encapsulant is much better than that using underfill. Bottom IC of POP has been studied for further understanding of LGA assembly process parameters. All details such as assembly process, drop test and thermal cycling test will be discussed in this paper.
ETA Smartphone Inline SMT PCBA Router Machine ETA-IR180 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCB cutting machine,PCB cutter,PCB
With the Spectrum II's new Precision Z-axis, smaller dots and thinner solder paste lines can be achieved. This capability is standard on all Spectrum II systems and replaces the Precision Z option on the older Axiom products. In order to achieve su
Career Center | Poway, California USA | Engineering,Production
Technically qualified in proper operation, troubleshooting, installation /dismantling, programming and preventive maintenance of SMT (Surface Mount Technology) machines. Productivity and quality for the production of PCBA (Printed Circuit Board Ass
Nippon Mining & Metals Smartphones and tablets requi
Main Products: 1. Original new and Original Used SMT/AI Spare Parts. 2. SMT Equipments And Related Machine( SMT Calibration, SMT Feeder Carts,Conveyer etc.) 3. Maintenace and Repair Service Pre-Sales Service Provide details ab
Manufacturer's Representative / Manufacturer / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
Building A, Jiepeng Square, Fuyong
Shenzhen, China
Phone: 0755-33578694
